Qoltec
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Reģistrēties un redzēt cenas Jau esat partneris? IenāktA thermal compound with a thermal conductivity of 8 W/m-K facilitates effective heat dissipation between a heating component and a heat sink. It is suitable for use with, amongst other things, processors, integrated circuits, electronic modules and other components requiring improved heat transfer. The material does not conduct electricity
